Micro-manipulation Method of Dual Directions Magnetic Driving Synthetic Micro-Wedge Structure

With the development of micro-electronics and ultra-precision machining technology, the precision picking and releasing of micro-scale devices are urgently needed in the manufacturing process of micro-electronic products. However, the existing robot micromanipulation techniques have the problems of low release success rate and difficult to guarantee the stability of the picking process. This paper explores the micro-wedges deformation under the action of external magnetic field and proposes two controllable interface adhesion regulation methods: the single positive direction magnetic field controls deformation and recovery of wedges as the first regulation method, which can ensure the stability in the picking process, and the second regulation method is anisotropic deformation of wedges under the dual directions magnetic field, which can greatly improve the success rate of release due to contact only at the single wedge in release stage. The normal adhesion force test and the micron-scale silicon wafer transport experiment also proves the feasibility of the two regulation methods, among which normal adhesion force can be decreased 78-fold by changing contact area via the dual directions magnetic field.