Microfibrous Mesh and Polymer Damping of Micromachined Vibration Isolators

Brent Bottenfield, Arthur Gernt Bond, Brian A. English,George T. Flowers,Robert N. Dean,Mark L. Adams

IEEE Transactions on Components, Packaging and Manufacturing Technology（2021）

引用 3|浏览0

暂无评分

摘要

This article introduces the use of nickel (Ni) and copper (Cu) microfibrous meshes (MFMs) and Sorbothane and polydimethylsiloxane (PDMS) viscoelastic polymers to damp the dynamic response of a silicon micromachined vibration isolator (microisolator) for vibration reliability in mechanically harsh environments. The $9\times 9$ mm 2 microisolator is designed to house a small, packaged MEMS sensor ...

查看译文

关键词

Damping,Vibrations,Isolators,Sensitivity,Acceleration,Electric shock,Q-factor

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要