Cryogenic thermal conductivity of carbon fiber reinforced polymer composite laminates

Yuanchen Li, Zhanzhi Zhang, Shengbao Wu,Zeang Zhao,Hongshuai Lei

International Journal of Heat and Mass Transfer(2024)

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摘要
Carbon fiber reinforced polymer (CFRP) composites with excellent mechanical properties and low thermal conductivity are promising materials for cryogenic facility support structures. However, the temperature dependence and stacking sequence dependence of the laminates’ thermal conductivities challenge their thermo-mechanical design. Previous work dealing with the cryogenic thermal conductivity of laminates was relatively inadequate, and the effect of stacking sequence has not been sufficiently clarified. Herein, the cryogenic thermal conductivity of CFRP composite was investigated, and a theoretical model for the out-of-plane thermal conductivity of laminate was developed. To this end, the thermal conductivities of epoxy resin and laminates were measured at temperatures from 20 K to 293 K. The cryogenic thermal conductivity of carbon fiber was then extrapolated. Subsequently, a theoretical model was developed based on the thermal-electrical analogy method to evaluate the effect of stacking sequence. The obtained model was then validated by numerical analysis and experimental work. Lastly, the effects of lay-up angles and component properties on out-of-plane conductivity were examined. The test results suggested longitudinal thermal conductivity of composites exhibiting significant temperature dependence, with a decreasing trend recorded from 6.317 Wm−1K−1 to 0.355 Wm−1K−1 and transverse thermal conductivity decline from 0.626 Wm−1K−1 to 0.156 Wm−1K−1. The theoretical analysis indicated that the stacking sequence could reduce the out-of-face thermal conductivity by up to approximately 6.5 %, while the lay-up angle did not show any influence. In sum, novel insights into the cryogenic thermal conductivity of CFRP composites were provided, with guidance for the design and analysis of CFRP composites in cryogenic applications.
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关键词
Thermal conductivity,Cryogenic environments,Polymer composite,Theoretical model
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