Fused deposition modelling of dense complex-shaped SiCp/Al composites with excellent properties

SiCp/Al composites are widely used in space vehicles, electronic packaging, automobiles, rail vehicles and other fields due to their excellent mechanical and thermal properties. Complex-shape SiCp/Al parts are usually manufactured by mechanical processing, which is expensive and time-consuming due to the high hardness of SiC phase. As a highly effective 3D molding method, Fused Deposition Modelling (FDM) of the complex-structure SiCp/Al composites was reported for the first time in this paper. SiCp/Al composites was densified by pressureless infiltration after FDM, and as-acquired bulk possessed high densification of 92.67 % and the SiC volume fraction of 43.2 %. Moreover, excellent performances were also presented, including flexural strength of 211 MPa, thermal conductivity of 112(W/m·K), and the thermal expansion coefficient of 8.67 × 10-6K−1.