Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions

An epoxy resin thermally conductive adhesive is a type of thermosetting polymer encapsulation material that exhibits comprehensive performance, and the thermomechanical properties of this adhesive vary significantly under different curing conditions. In this paper, spherical alumina was used as a filler for thermal conductivity to prepare an epoxy resin thermal conductivity adhesive using a multistage freezing mixing method. The effects of various curing conditions on the thermal-mechanical properties and fracture morphology of the epoxy resin thermal conductivity adhesive were studied. The results showed that the curing condition of 150 degrees C/2.5 h significantly improved the performance of the epoxy resin thermally conductive adhesive. Through the shear test of the composite material, the influence of the curing agent on the adhesion of the thermally conductive adhesive under fixed conditions was explored. It was found that the curing agent with a superbranched structure exhibited latent properties and greatly enhanced the toughness of the cured epoxy resin product. Altering the curing conditions increases the shear strength by up to 307%. With the increase in curing temperature and the extension of curing temperature, the glass transition temperature gradually increased from 103.9 to 159.8 degrees C. The initial decomposition temperature T-IDT gradually increased from 295.4 to 310.1 degrees C, and the temperature at which the fastest decomposition rate occurs (T-max) gradually increased from 312.48 to 330.33 degrees C. The thermal stability of the substance increased with both temperature and time. The curing time and curing temperature were increased, and the morphology of the fracture of the epoxy resin thermally conductive adhesive cured sample gradually showed a ductile fracture from a typical brittle fracture. The research results reveal the influence of curing conditions on the thermal conductivity and thermal stability of the epoxy resin thermally conductive adhesive, which has a specific reference value for improving the performance of the epoxy resin thermally conductive adhesive, optimizing its usage conditions, and improving production efficiency.