Through-silicon isolation based on dry filling and reflow of micron glass powders

Wenduan Zhou,Biyun Ling, Dong Chen, Qiao Xu, Yuhu Xia, Minli Cai,Yaming Wu

2024 IEEE 37TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMS(2024)

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摘要
This paper, for the first time, introduces glass powders into through-silicon isolation, and fabricates a monolayered combs-angle-sensor-integrated biaxial gimbal with 250 mu m-thickness and 1cm-diameter. Micron dry glass powders are filled into through holes by a silica-gel scraper, which is followed by surface cleaning to wipe off residual powders and reflow to turn these incompact glass powders into solidified glass liners respectively. These glass liners electrically insulate combs angle sensors from the main body of gimbal while maintaining robust mechanical connections. This gimbal is applied to development of magnetically-driven and closed-loop controlled mirror with millimeter-level size. Experimental results reveal that the insulation resistance value of each glass liner reaches T Omega-level. Furthermore, the glass liner is proved to be tolerant to mechanical impact and vibration in the process of assembling magnetic actuator and mirror onto this gimbal.
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关键词
Through-Silicon Insulation,Glass Particles,Reflow,Dry Filling,Monolayered Combs-angle-sensor-integrated Biaxial Gimbal
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