Accelerating the kinetics of curing reaction of SBR/BR blend by silicon carbide via modification of thermal diffusivity

In this work, the accelerating effect of nano-silicon carbide (SiC) as a high thermal conductive filler on the kinetics of curing reaction of styrene-butadiene rubber/butadiene rubber (SBR/BR) as a compound for tire tread was investigated. The oscillating disk rheometer (ODR) showed that the SiC filler reduced the scorch and optimum curing times by -10%. The SiC amount of 5 phr caused an unparalleled reduction of -50% in the time difference between the scorch and curing times. The calculated parameters of the autocatalytic kinetic model of Kamal-Sourour using ODR results indicated that SiC accelerated the curing reaction by -1.25 times. To find the main mechanism of action of SiC in the improvement of vulcanization kinetic of SBR/BR-SiC, thermal diffusivity of the compound was detected in the thermalization process using a special setup during the curing and also the dethermalization process after that. The results exhibited that the SiC particles led to enhanced heat transfer rate into the compound during the vulcanization by -30% and into the cured composite by -50%, particularly at 5 phr of SiC. Moreover, fitting the heat transfer equation on the dethermalization data showed that the amount of 5 phr SiC in the recipe enhanced the thermal diffusivity by similar to 97%, which can prevent the tire explosion while deriving due to the increment of the air temperature within the tire. The SiC filler can save significant energy in the manufacturing process of the tire tread, which has been neglected so far.