Design of a Novel Double Sided Cooling SiC Power Module Based on Multiple DBC-Stacked

2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)(2023)

引用 0|浏览4
暂无评分
摘要
With the increasing power density and operating frequency of power electronic system, the heat dissipation and electromagnetic performance of traditional packaged power module can not meet the requirements of the system. Silicon carbide (SiC) double-sided cooling power module has the advantages of high reliability, high density, high power and high efficiency, and has a wide application prospect in power electronic systems such as electric vehicle motor controller. In this paper, a new type of double-sided cooling power module with laminated DBC structure is designed. The module can effectively reduce the stray inductance and improve the current passing ability of the module. The design enables up to 12 SiC chips in parallel with a stream capacity of 1000A. The module finally passed electrical and thermal simulation evaluation and dual pulse testing.
更多
查看译文
关键词
Silicon carbide,DBC-Stacked,double-sided cooling
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要