FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY(2023)

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摘要
Recently, with the widespread application of flexible printed circuit boards (FPCBs) in smart electronic devices, FPCB surface defect detection has become an increasingly critical issue. In this study, a novel convolutional neural network framework based on transfer learning and multiscale spectral-spatial feature fusion (FPCB-Det) is proposed to detect FPCB surface defects. The proposed framework comprises a classification network (FPCB-ClaNet) and a localization network (FPCB-LocNet). Specifically, data augmentation (DA), class-balanced (CB) sampling, weight decay, and an attention mechanism are applied to enhance the performance of FPCB-ClaNet, and FPCB-LocNet uses 3-D convolution kernels with different sizes to jointly extract spectral-spatial features and achieves pixel-level segmentation of FPCB hyperspectral images (HSIs). The experimental results show that the classification accuracy of FPCB-ClaNet is as high as 97.84%, and the segmentation accuracy of FPCB-LocNet is as high as 97.86% compared with traditional image segmentation methods. The proposed FPCB-Det network can be applied to the actual production of FPCBs.
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关键词
Convolutional neural network,data imbalance,flexible printed circuit board (FPCB),hyperspectral image (HSI),surface defect detection
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