Microstructural and mechanical characterization of Cu/SiC composite fabricated by friction stir processing

This work focuses on reinforcement of silicon carbides ceramic in copper matrix for composite fabrication by friction stir processing. Microstructure was seen through microscopes (optical microscopy and scanning electron microscope). Microstructure revealed substantial grain refinement in FSPed composite supposed to be due to dynamic recrystallization. Sputtering of particles was uniform in the processed zone with proper bonding with copper. The processing conditions and non-melting nature of the process may be responsible for the fair and homogeneous sputtering of the particles. The presence of particles in the matrix led to higher hardness and strength. The high hardness and strength of the composite may because of combined effect of following strengthening mechanism: grain refinement, varied thermal expansion coefficient, Orowan mechanism and shear lag mechanism.