A 3.8 mW 1.9 m/Hz Electrical Impedance Tomography Imaging with 28.4 M High Input Impedance and Loading Calibration

IEEE 49TH EUROPEAN SOLID STATE CIRCUITS CONFERENCE, ESSCIRC 2023(2023)

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摘要
This paper proposes an advanced electrical impedance tomography (EIT) imaging IC that is designed to enhance stability against contact impedance variations. The 6 mm(2) chip is fabricated using a TSMC 180 nm CMOS process and contains 2 key features: 1) a high input impedance instrumentation amplifier (IA) with auxiliary source followers for robust voltage sensing, and 2) a Trans-Conductance (TC) current driver with Trans-Impedance (TI) monitoring circuit for precise measurement of the injected current while eliminating the loading effect. The proposed IC has a low power dissipation of only 3.8 mW, excluding the injection current, and offers an impressive impedance resolution of 1.9 m Omega/root Hz. The input impedance of the IA has been increased up to 2.9 G Omega at 100 Hz and 230 k Omega at 1 MHz, indicating high performance over a wide range of frequencies. The effectiveness of the proposed EIT imaging IC is demonstrated by successfully reconstructing 3D images of a human body phantom using a mobile device.
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关键词
Active shield buffer, breast cancer detection, electrical impedance tomography (EIT), impedance spectroscopy, injection current monitoring, loading calibration
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