A Numerical and Experimental Butt-Coupling Analysis of GaSb Diode Laser Grown on Silicon Photonic Integrated Circuit

2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)(2023)

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摘要
Nowadays, Silicon (Si) photonics represents the most mature technology enabling low-cost Photonic Integrated Circuits (PICs). The approach based on the monolithic integration, i.e. by direct epitaxy, of III-V lasers on Si PICs opens new avenues for low-cost and high integration density of light sources on Si wafers. In this work, we study both theoretically and experimentally the optical coupling efficiency between a 2.3 μm GaSb diode laser (DL), epitaxially grown on on-axis Si (001) [1], and passive SiN waveguides (WGs) in the butt coupling configuration. Alternative approaches to improve the light transmission are also proposed.
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2.3 μm GaSb diode laser,butt coupling configuration,direct epitaxy,experimental butt-coupling analysis,GaSb/bin,high integration density,III-V lasers,light sources,light transmission,low-cost photonic integrated circuits,monolithic integration,numerical butt-coupling analysis,on-axis Si(001),optical coupling efficiency,passive SiN waveguides,Si PICs,Si wafers,Si/sur,silicon photonic integrated circuit,SiN/bin,wavelength 2.3 mum
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