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Toward Rapid Prototyping of High-Aspect-Ratio Sub-$\mathbf{100}-\mu \mathbf{m}$ PMMA Microfluidic Devices: Optimization of CO2 Laser Machining and Solvent-Assisted Thermal Bonding

2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS)(2019)

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摘要
In this work, optimization of CO 2 -laser machining and solvent-assisted thermal bonding of PMMA [poly (methyl methacrylate)] sheet for rapid prototyping of microfluidic devices with sub- 100-μm and high-aspect-ratio (AR) feature is reported. Design of experiments (DOE) was used to optimize the set of cutting parameters that allowed us to achieve unprecedented minimum channel width of 57.5 μm with a high AR of 3.5:1 having smooth inner surfaces in contrast to Gaussian-shaped channels with rough inner surface, cut by conventional engraving-mode laser machining.
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关键词
rapid prototyping,high-aspect-ratio sub,PMMA microfluidic devices,CO2 laser machining,solvent-assisted thermal bonding,methyl methacrylate,high-aspect-ratio feature,unprecedented minimum channel width,engraving-mode laser machining,PMMA poly-sheet,DOE,design of experiments,Gaussian-shaped channels,CO2
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