Heat Dissipation Design and Verification of Military Electronic Equipment Using 3D Printing Duct

In this study, the heat dissipation structure of the high-heat electronic equipment system was improved using the CFD analysis technique and 3D printing duct. By arranging the power supply in a separate space, the amount of cooling air flowing into the circuit card assembly was increased, and a geometric 3D printing duct was installed to concentrate cooling air into the high-heating circuit card assembly. Subsequently, an improved prototype was manufactured and operation tests were conducted in a high-temperature environment. The results confirmed that the electronic equipment was operated stably at high temperature and that the high-heat circuit card assembly had an average high-temperature margin of 17 degrees C based on the allowable temperature.