Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis

Chaofeng Li,Kevin Cai,Muqi Ouyang, Manish Kizhakkeveettil Mathew, Mehdi Mousav,Bidyut Sen,DongHyun Kim

2023 JOINT ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY, APEMC/INCEMIC(2023)

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摘要
The mode-decomposition-based equivalent via (MEV) model is proposed in this paper, which is a physics-based equivalent model for the high-speed channel modeling. The application ranges of the MEV model are analyzed by varying anti-pad radius, via radius, and distance between the parallel plates for a single via with multiple layers. Based on the S-parameter comparison with full-wave simulations, the MEV model is useful for the insertion loss calculation up to 100 GHz. Meanwhile, the return loss from the MEV model shows a high level of correlation with full-wave simulation results up to 70GHz, even when the anti-pad radius is larger than the commonly used size. The parallel-plate height has a negligible impact on the accuracy of the MEV model. This paper demonstrates the large application range of the MEV model and verifies that MEV model is suitable for practical high-speed via analysis.
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关键词
mode-decomposition,parallel plate mode,high-order modes,equivalent via model,high-speed channel
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