Ionic Sensor Package Design for the Survivability in a Drop/Impact During Deployment

By utilizing different outer package designs and materials, it is possible to reduce or isolate impact energy, which can prevent damage or destruction of interconnections and chips that would otherwise occur due to solder-joint fractures, chip cracks, pad craters, and other impacts. To ensure that internal electronics remain moisture-resistant and protected from impacts of up to 30 mph, special packaging has been developed. In this study, the ANSYS/LS-DYNA finite element analysis tool was used to evaluate the effectiveness of several designs in minimizing shock energy transmitted to a PCB. The outer foam packing was modified to increase the effective thickness of the PCB and reduce its deformation. This was achieved by combining different designs, including a two-layer foam packing, a one-layer foam packing, and modifications to the stress-strain curve of the foam material. The results of this study showed that the combination of these designs reduced the deformation of the PCB by 86.9%, with a final deformation of only 52 mu m compared to the initial design, which had a deformation of 398.7 mu m.