Ultra-Compact Silicon-Based 180-Degree Waveguide Bend Using Digital Metamaterials

Bending waveguide is one of the building blocks of on-chip photonic integrated circuits (PICs). Previous bending waveguides (BWs) usually suffer from larger footprint size in the bending region, which is are not conducive to develop large-scale and high-density PICs. To this end, we propose and numerically investigate an ultra-compact silicon-on-insulator 180-degree waveguide bend with a bending radius of 2 µm. Being different from the previous BWs, the design is based on topologically optimized digital metamaterials, which is implemented by using intelligent genetic algorithms. Simulated results show that the proposed structure has a -1.36 dB bend efficiency per 180-degree at a wavelength of 1.55 µm and occupies a footprint of only 4 × 4 µm2. Moreover, the crosstalk is <−20 dB and the loss is <2.6 dB over a >100 nm operating bandwidth (1.6-1.7 µm) for TE0 modes. With the wide operating bandwidth and ultra-compact footprint, the proposed silicon-based 180-degree waveguide bend shows a potential application as the fundamental component for optical communication interconnect in the ultra-highly integrated photonic circuit.