Fabrication of rigid polyimide foams with good mechanical and thermal properties

Rigid polyimide foams (PIFs) were successfully fabricated through thermal foaming of polyester ammonium salt precursors (PEASs) with the addition of a pararosaniline base (PA) as a crosslinker. These foams exhibited good mechanical properties and thermal resistance. The construction of crosslinked structure derived from PA could improve melt viscosity and provide cell walls with sufficient strength to prevent shrinkage, which was conducive to elevating compressive properties. PIFBMP-2 (i.e., repeating unit was 2) exhibited optimal compressive strength of 1.76 and 1.25 MPa at room temperature (RT) and 200 °C, which were increased by 6.6 and 7.9 times compared to PIFBM (0.17 MPa (RT) and 0.11 MPa (200 °C)). Furthermore, a relationship between compressive strength and density was established, showing that the compressive strength is proportional to 2.34 and 2.13 powers of density at RT and 200 °C, respectively. Moreover, PIFs owned excellent thermal properties, the 5% weight loss temperature was higher than 458.9 °C in a nitrogen (N2) atmosphere, and the glass transition temperature was up to 291.3 °C. Additionally, the thermal conductivities of the rigid polyimide foams (PIFs) ranged from 0.058 to 0.094 W m−1 K−1, which makes them highly suitable for potential applications in the fabrication of high-temperature resistant multifunctional composites, particularly in aerospace, defense, and transportation industries.