Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer (TM)

Simon Chun Kiat Goh,Baochang Xu,Yu Zhang,Chun Fei Siah, Bo Zhao, Rappl Sebastian, James Yong Meng Lee,Suresh Venkatesan,Aaron Voon Yew Thean,Yeow Kheng Lim

2022 EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC)（2022）

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摘要

The incorporation of rectangular slide-stop structures improve post-bond accuracy by 1.6X achieving a best-in-class relative axial offset of 0.13 m. High-precision bonder with laser-assisted bonding capability enables heterogeneous integration of optical components with higher packing density due to a small heat-affected zone radius of 280 mu m. (C) 2022 The Author(s)

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关键词

best-in-class relative axial offset,CMOS-based optical interposer,heat-affected zone radius,heterogeneous integration,high-precision bonder,LAB,laser-assisted bonding capability,multiaxial slide-stop guided design,optical components,packing density,passively aligned flip-chip laser diodes,post-bond accuracy,radius 280.0 mum,rectangular slide-stop structures

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