Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints

Purpose - Solder bumps for chip interconnections are downsizing from current approximately 100 mu m to the expected 1 mu m in future. As a result, the Cu-Ni cross-interaction in Cu/Solder/Ni solder joints will be more complicated and then strongly influence the growth of the intermetallic compounds (IMCs). Thus, it is critical to understand the fundamental aspects of interfacial reaction in micro solder joints. This paper aims to reveal the effect mechanism of reflow temperature and solder size on the interfacial reaction in Cu/Solder/Ni solder joints. Design/methodology/approach - The Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints with 50 and 100 mu m solder sizes at 250 degrees C and 300 degrees C were observed, respectively. The line-type interconnects were soaked in silicone oil, and the temperature of the line-type interconnects was 250 +/- 3 degrees C and 300 +/- 3 degrees C, which were monitored by a fine K-type thermocouple, and followed by an isothermal aging process at various times. After aging, the specimens were removed from the silicone oil and cooled in the air to room temperature. Findings - The major interfacial reaction product on both interfaces was (Cu,Ni)(6)Sn-5, and the asymmetric growth of (Cu,Ni)(6)Sn-5, evidenced by the thickness of (Cu,Ni)(6)Sn-5 IMCs at the Sn/Ni interface was always larger than that at the Sn/Cu interface, resulted from the directional migration of Cu atoms toward the Sn/Ni interface under Cu concentration gradient. The morphology of (Cu,Ni)(6)Sn-5 IMC at Sn/Cu interface was columnlike at 250 degrees C, and which changed from columnlike to scallop with large aspect ratio at 300 degrees C, while that at Sn/Ni interface gradually evolved from needlelike to the mixture of needlelike and layered at 250 degrees C, and which evolved from needlelike to scallop with large aspect ratio at 300 degrees C. The evolution of morphology of (Cu,Ni)(6)Sn-5 is attributed to the content of Ni. Furthermore, the results indicate that the Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints. Originality/value - The asymmetric growth of (Cu,Ni)(6)Sn-5 in the Cu/Sn/Ni micro solder joints, evidenced by the thickness of (Cu,Ni)(6)Sn-5 IMCs at the Sn/Ni interface, was always larger than that at the Sn/Cu interface. The morphology evolution of (Cu,Ni)(6)Sn-5 IMC at both interfaces was attributed to the content of Ni. The Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints.