Experimental investigation of rectangular mini channel array as an effective tool for energy efficient cooling of electronic gadgets

In this paper, an experimental investigation of heat transfer and fluid flow analysis of rectangular mini channel array under steady flow condition is carried out. The channel dimensions are selected in such a way that, flow within the channel is maintained hydro dynamically developed and thermally developing. This type of flow gives enhancement in heat transfer with considerably reduced frictional pressure loss. This study indicates that with a mini channel array maximum heat flux dissipation is extended up to 1.5 MW/m(2) at a pressure drop of 8.671kPa. In addition to this, enhancement of heat transfer per unit pumping power (Q/P-p) is also increased by three fold for average heat flux dissipation of 1.25 MW/m(2) as against 0.6 MW/m(2) at Re = 191. Total minimum thermal resistance reported in this experimentation is 0.128K/W, which is less than the maximum estimated thermal resistance of 0.132K/W for processor having predicted thermal design power (TDP) value of 303. Increase of average heat flux dissipation and reduction in thermal resistance at higher Re (Re > 400) result in substantially reduction in junction temperature T-j(<338K). This results into increase in reliability and sustainability of high heat flux generating electronic gadgets with increase in speed of performing arithmetic computational capabilities.