Sputtering Codeposition and Metal-Induced Crystallization to Enhance the Power Factor of Nanocrystalline Silicon

The power factor of highly boron-doped nano-crystalline Si thin films with controlled doping concentration is investigated. We achieve a high degree of tuning of boron content with a charge carrier concentration from 1018 to 1021/cm3 and with the electrical conductivity by varying the boron magnetron power from 10 to 60 W while maintaining the power of a SiB source constant during codeposition from two independent sputtering sources. Along with the increase in the electrical conductivity with increased boron doping, we observe a steady decrease in the Seebeck coefficient from 500 to 100 mu V/K. These values result in power factors that exhibit a marked maximum of 5 mW/K2m for a carrier concentration of around 1021/cm3 at room temperature. Temperature-dependent measurements up to 650 degrees C show, with increasing doping concentration, a change of the resistivity from a semiconducting to a metallic behavior and an increase of both Seebeck coefficient and power factor, with this last one peaking at 9.8 mW/K2m in the 350-550 degrees C temperature range. For higher concentrations, scanning electron microscopy and energy-dispersive X-ray spectroscopy show a partial segregation of boron on particles on the surface. These results exemplify the great advantage of sputtering codeposition methods to easily tune and optimize the thermoelectric performance in thin films, obtaining in our specific case highly competitive power factors in a simple and reliable manner.