A housing design to optimize heat dissipation and reduced noise for LTE card module in communication terminal

A prototype of LTE communication terminal adopting to commercial use drones to be controlled by a central operational center is developed. Efficient heat path to reduce temperature rise of card type LTE module and FPGA (wafer level package, InFO) is installed in a small formfactor housing. The Main heat path shared by LTE module and FPGA also plays a role of a metallic shielding with EMC gasket to avoid communication performance degradation due to electro-magnetic interference observed in LTE band. Interference free LTE terminal is implemented by using unique shielding structure with some additional grounding technique in light weight plastic housing.