Surface generation mechanism in ultra-fine microgrinding (UMG) of single crystal silicon considering grinding tool topography

Ultra-fine microgrinding (UMG) with tool diameter of about 100 μm is a promising processing method in producing microstructures, but its service life has always been an important factor restricting its development. In this paper, through the simulation of grain trajectory, the influences of machining parameters, tool diameter, grain size, and distribution on the number of effective grains in UMG are analyzed. The characteristics of UMG and the effects of machining parameters on the surface quality are analyzed; an undeformed chip thickness model considering the non-uniformity of grinding tool morphology also is established. It is found that the influence law of machining parameters on undeformed chip thickness in traditional grinding is not fully applicable to UMG, but the influence law of feeding velocity and cutting depth on UMG machining quality is consistent with that in traditional grinding. Besides, it is found that blindly increasing rotation speed, reducing cutting depth and feeding velocity are not conducive to improving the number of effective grains and the service life of UMG tools. In view of this, machining parameters in UMG are optimized by response surface method, and the optimized processing parameters are experimentally verified.