Heat dissipation performance improvement of a solid-state fan using copper foams as collecting electrode

Heat dissipation for electronic devices is a rising issue today. In the present work, a solid-state fan (SSF) using copper foam as a collecting electrode has been developed. Experimental comparison and evalua-tion of the discharge characteristics and heat dissipation performance led to the optimization of the SSF's structure. The cooling of a high-power LED chip using the proposed SSF is followed by an experimental investigation into the luminous characteristics of the cooled LED chip. SSF with a mesh collector is com-pared with it as well. The results indicate that the 'needle-to-copper foam' SSF has a broader operating voltage range and a higher self-maintained discharge voltage than the 'needle-to-mesh' SSF, which leads to superior cooling performance at high applied voltage. The cooling impact is worse as the porosity in-creases but gets better with higher PPI values. The high-power LED chip's case temperature decreased by an additional 2.3 degrees C when the optimized SSF was used to cool it, and the output luminous properties is improved. Due to the benefits of comprehensive performance, a 'needle-to-copper foam' SSF has greater application potential in the heat dissipation of electronic devices than a 'needle-to-mesh' SSF.(c) 2022 Elsevier Ltd. All rights reserved.