The Impact of Processing Time Variations on Swap Sequence Performance in Dual-Armed Cluster Tools

IEEE Transactions on Automation Science and Engineering(2023)

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摘要
The performance of a swap sequence is analyzed by assuming cyclic scheduling in dual-armed cluster tools with processing time variations. A dual-armed cluster tool consists of multiple processing modules (PMs), one material handling robot that can hold two wafers at the same time, and loadlocks where wafer cassettes are loaded or unloaded. The swap sequence in a dual-armed cluster tool is widely used in practice and known to be optimal with deterministic processing times when the bottleneck PM’s workload is larger than the robot workload. However, in practice, processing times on a PM can have a small variation, which leads to a different processing time of each wafer on the PM. Hence, when the processing time variation is introduced, the performance of the swap sequence needs to be analyzed. This paper first defines a fundamental cycle and analyzes its cycle time. It then proposes optimality conditions of the swap sequence and performs numerical experiments to show the effectiveness of the sequence. Note to Practitioners—A dual-armed cluster tool used for semiconductor manufacturing processes is usually operated with a swap sequence because it is simple, easy to control, and proven to be optimal with deterministic processing times. However, studies on the performance of the swap sequence are still limited with processing times varying in PMs which often occur in practice. Hence, this study shows the effectiveness of the swap sequence with the processing time variations by analyzing cycle times, optimality conditions, and performing numerical experiments.
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关键词
Robots, Task analysis, Schedules, Time factors, Delays, Semiconductor device modeling, Clustering algorithms, Dual-armed cluster tool, performance analysis, processing time variation, semiconductor manufacturing, swap sequence
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