Numerical Simulation of the Thermal Stresses of Layered Molybdenum Disulfide

In this study, the finite element method was used to simulate and analyze thermal stresses of molybdenum disulfide (MoS2). Two models with or without micronized holes on the substrate were developed to simulate the distribution of thermal stresses, and thermal stresses of the two models were compared. Relationships between thermal stresses and temperature. MoS2, layer thickness, and substrate thickness were analyzed. The thermal stress of the substrate supported MoS2 was larger than that of the suspended MoS2. Moreover, the thermal stress of the MoS2 surrounding the suspended MoS2, was higher than that of the suspended part. Our results demonstrate that the thermal stresses of MoS2 increased with decrease in temperature. decrease in MoS2 thickness. and increase in substrate thickness.