Optimizing the Magnetic Properties of Cascaded Spin Valve Ellipses for Magnetic Field Sensors

Y. C. Su,K. W. Lee,Y. C. Lee,Van Su Luong,Jen-Hwa Hsu,J. T. Jeng,Ching-Ray Chang,Jen-Tzong Jeng,Jong-Ching Wu

2016 International Conference of Asian Union of Magnetics Societies (ICAUMS)（2016）

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摘要

The spin valve (SV) based field sensor has better signal output than anisotropy magnetoresistance (AMR) sensor. A SV multilayer with an in-plane magnetization anisotropy consisting of Ta 2/ IrMn 10/ CoFe 2.5 / Cu 2/ CoFe 2 / NiFe 2.5/ Ta 5 (thickness in nanometers) is prepared by means of sputtering. A field cooling at 550 K under an external magnetic field of 2 KOe is then employed. Nano-patterning is carried out by using a standard electron beam lithography in conjunction with ion-milling etching technique. A standard four-terminal ac lock-in measurement is employed to characterize the reversal behaviors. We find the reversal behaviors of cascaded SV device can be controlled by gap value and field cool again.

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关键词

cascaded SV device,reversal behaviors,standard four-terminal ac lock-in measurement,ion-milling etching technique,nanopatterning,field cooling,sputtering,SV multilayer,spin valve based field sensor,anisotropy magnetoresistance sensor,magnetic properties,standard electron beam lithography,external magnetic field,in-plane magnetization anisotropy,signal output,magnetic field sensors,cascaded spin valve ellipses,temperature 550.0 K,Ta-IrMn-CoFe-Cu-CoFe-NiFe-Ta

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