An innovative probe microscopy solution for measuring conductivity profiles in 3-dimensions

U. Celano,K. Paredis, A. D. L. Humphris, M. Tedaldi, C. O'Sullivan, J. P. Hole, J. Goulden

Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV(2021)

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摘要
The ever-increasing complexity of materials and architectures in nanoelectronics devices has driven the demand for new high-resolution imaging methods. Specifically, for three-dimensional (3D) analysis of confined volumes, atomic force microscopy (AFM) has been recently explored as a method for tomographic sensing. Here, we report on the innovative design of a dedicated microscopy solution for volumetric nanoscale analyses that achieves tomographic AFM by using a novel multi-probe sensing architecture. First, we describe the development of a custom scan head that is based on an exchangeable multi-probe hardware. Second, we demonstrate the use of our machine for tip-induced material removal in thick SiO2. Finally, we perform a tomographic reconstruction of nanosized poly-Si vertical channels, considered here as a prototypical system for vertical memory cells.
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