Nature of CoCrFeMnNi/Fe and CoCrFeMnNi/Al Solid/Solid Interface

ACTA METALLURGICA SINICA-ENGLISH LETTERS(2021)

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摘要
To shed light into the application potential of high-entropy alloys as “interlayer” materials for Al-steel solid-state joining, we investigated the nature of the CoCrFeMnNi/Fe and CoCrFeMnNi/Al solid/solid interfaces, focusing on the bonding behavior and phase components. Good metallurgical bonding without the formation of hard and brittle IMC can be achieved for CoCrFeMnNi/Fe solid/solid interface. In contrast to the formation of Al 5 Fe 2 phase at the Fe/Al interface, Al 13 Fe 4 -type IMC, in which the Fe site is co-occupied equally by Co, Cr, Fe, Mn and Ni, dominates the CoCrFeMnNi/Al interface. Although the formation of IMC at the CoCrFeMnNi/Al interface is not avoidable, the thickness and hardness of the Al 13 (CoCrFeMnNi) 4 phase formed at the CoCrFeMnNi/Al interface are significantly lower than the Al 5 Fe 2 phase formed at the Fe/Al interface. The activation energies for the interdiffusion of Fe/Al and CoCrFeMnNi/Al static diffusion couple are 341.6 kJ/mol and 329.5 kJ/mol, respectively. Despite this similarity, under identical static annealing condition, the interdiffusion coefficient of the CoCrFeMnNi/Al diffusion couple is significantly lower than that of the Fe/Al diffusion couple. This is thus mainly a result of the reduced atomic mobility/diffusivity caused by the compositional complexity in CoCrFeMnNi high-entropy alloy.
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关键词
High-entropy alloy, Microstructure, Metallurgical bonding, Interface
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