Silicon Photomultipliers With 8-Mu M Thick Substrate For Enhancing Photo-Sensitivity In The 900-Nm Range And Reducing Afterpulse And Delayed Crosstalk

Yuki Nobusa, Honam Kwon,Ikuo Fujiwara,Keita Sasaki,Kazuhiro Suzuki

INTEGRATED OPTICS: DEVICES, MATERIALS, AND TECHNOLOGIES XXIII(2019)

引用 1|浏览1
暂无评分
摘要
Light detection and ranging (LiDAR) systems are potential candidates as sensing systems for autonomous driving. Light sensor performance is highly related to the distance measuring capabilities of the LiDAR system. Silicon photomultipliers (SiPM) have attracted attention because of their capability for detecting even single photons of light [1]. To increase the utilization efficiency of incident light, we thinned the SiPM substrate for light reflectance in the structure to a thickness of 8 mu m. This improved photon detection efficiency (PDE) to 1.6 times that of a 700- mu m device at an exceeding voltage of 4.0 V above the avalanche breakdown voltage. By reducing diffusion carriers from the substrate, time- lagged signals such as afterpulse or delayed crosstalk were suppressed to 60 %.
更多
查看译文
关键词
SiPM, SPAD, LiDAR, ADAS, NIR sensitivity, thinning process, afterpulse, delayed crosstalk
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要