Simulation And Verification Of Thermal Conductivity Of Cucr30 Contact Material Based On Morphological Changes Of Cr Particles

In order to improve the thermal deposition of CuCr contact material for vacuum interrupter, CuCr30 contact material was treated with large deformation treatment to change the morphology and distribution of Cr particles, and the effect of the morphology change of Cr particle on the thermal conductivity of CuCr30 contact material was studied. At the same time, the finite element simulation of the thermal transfer behavior of the extruded and cast CuCr30 contact materials was carried out by using ANSYS software. The studies show that the large deformation treatment (deformation ratio 16:1) changes the morphology and distribution of Cr particles in CuCr30 contact material, making it change from dendritic to longitudinally arranged quasi-fibrous. Influenced by the morphology and distribution of Cr particles, the thermal conductivity of CuCr30 contact material is anisotropic, and the effective thermal conductivity varies significantly with the direction. Indeed along the deformation direction, the thermal conductivity of the extruded state is obviously higher than that of the cast state, increasing by 5.8 %. However, perpendicular to the extrusion direction, the thermal conductivity has little changes, and obvious deposition phenomenon appears in the process of thermal conduction. The finite element simulation results of the effective thermal conductivity of CuCr30 material by ANSYS are in good agreement with the measured results, and the error range is 0.7 %similar to 1%.