Laser-Induced Forward Transfer of silver-based pastes for metallization of photovoltaic devices

Laser-induced forward transfer (LIFT) is a fast, clean, non-contact metallization technique that allows the deposition of small volumes (down to picoliters) of a wide range of materials in a very precise and controlled way. In this work, we show a complete description of the metallization by LIFT using pulsed laser sources and a commercial silver-based paste. We include a description of the transference process and discuss the influence of the paste viscosity and the acceptor substrate roughness. To avoid the use of a standard paste-curing process in a furnace, a second laser process is used to cure the silver paste in a selective way, preventing any thermal damage in the materials below the paste or in other parts of the device. In summary, we show that the use of a LIFT technique allows the metallization of wide areas with high aspect ratio lines, that can be cured selectively, and present very good mechanical properties, being suitable for its use in flexible electronics applications.