Data acquisition and processing circuit for high-temperature logging up to 200 degrees C

MICROELECTRONICS INTERNATIONAL(2020)

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摘要
Purpose This paper aims to study a high-temperature (up to 200 degrees C) data acquisition and processing circuit for logging. Design/methodology/approach With the decrease in thermal resistance by system-in package technology and exquisite power consumption distribution design, the circuit worked well at high temperatures environment from both theoretical analysis and real experiments evaluation. Findings In thermal simulation, considering on board chips' power consumption as additional heat source, the highest temperature point reached by all the chips in the circuit is only 211 degrees C at work temperature of 200 degrees C. In addition, the proposed circuit was validated by long time high-temperature experiments. The circuit showed good dynamic performance during a 4-h test in a 200-degrees C oven, and maintained a signal-to-noise ratio of 92.54 dB, a signal-to-noise and distortion ratio of 91.81 dB, a total harmonic distortion of -99.89 dB and a spurious free dynamic range of 100.28 dB. Originality/value The proposed circuit and methodology showed great potential for application in deep-well logging systems and other high-temperature situations.
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关键词
Thermal simulation,High temperature,Data acquisition and processing,Logging,System-in-package
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