Study on texture and dynamic recrystallization behavior of high purity copper during reverse extrusion

The dynamic recrystallization (DRX) behavior of high purity copper was studied by the combination of numerical simulation and experiment. Specifically, extrusion experiments were performed in the temperature range of 200 degrees C similar to 800 degrees C. The effects of temperature and deformation on the microstructure of the deformation zone were studied. It was found that the grain size decreased with the decrease of temperature and the increase of deformation. The optimized extrusion temperature of 500 degrees C similar to 550 degrees C was determined based on grain size and uniformity of microstructure. The special grain boundaries, grain orientation and recrystallization texture during extrusion were studied by electron backscattered diffraction (EBSD) technique. It was found that the increase of the special grain boundary Sigma 3 and the texture of < 111 > parallel to the ED direction have a positive effect on grain refinement and microstructure uniformity. As the temperature increases, the proportion of recrystallized grains increases initially, and finally decreases. A cellular automaton (CA) method that couples the developed DRX model was implemented to investigate the evolution of microstructure during high-purity copper extrusion using DEFORM-3D software, and the results were verified by experiments. The microstructure evolution and average grain size distribution predicted by numerical simulation agreed well with the experimental results.