The Study on Simulation of Thermal-Mechanical Characteristics according to Structural Factors of EMC Filling via in the Multi-layered FOWLP

Recently, research on Through Mold Via (TMV) technology has been developing for multi-layering in Fan-Out Wafer Level Package (FOWLP). However, it is difficult to apply mass production processes due to permanent deformations such as extrusion, cracks, and warpage of Cu materials that form TMV, also sudden temperature changes during the use of chips cause heat fatigue in the TMV. As a solution to this problem, the EMC Filling Via (EFV) that form thin-thickness Cu-Via and then fill inside the Via with EMC is developed. This study analyzed the thermal-mechanical characteristics of the EFV in the multi-layered FOWLP according to structural variables such as location, deposited thickness and angle in order to minimize thermal stress generated while using the chip through simulation. As a result, the EFV has better thermal-mechanical properties the further away from heat sources, and thermal stress in the EFV is increased as the deposited thickness and angle increase.