Modelling and analysis of vibration on power electronic module structure and application of model order reduction

Microelectronics Reliability(2020)

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摘要
Modelling and analysis of vibration of an IGBT power electronic module (PEM) structure were undertaken. PEM structure considered in this study was without molding compound and wirebonds. The most critical resonant frequency was identified by modal analysis. At the critical frequency of 1345 Hz, for the vertical displacement of the base excitation, subsequent stress distribution on the PEM structure was analysed. Concurrent vibration and thermo-mechanical fatigue loads on the reliability of PEM structure solder interconnects were also estimated by widely used linear damage superposition approach. It was concluded that the at critical resonant frequency the vibration induced damage is more severe than the thermo-mechanical fatigue loading. In addition, a quarter car model (QCM) was used to mimic the dynamic interaction between the rough road surface and an electric vehicle (EV) in order to analyse the road surface roughness induced excitation on the PEM structure in the engine compartment. Stress and strain distribution on the PEM structure due to road surface roughness were analysed. Furthermore, three Krylov subspace based model order reduction (MOR) techniques were applied to the resulting dynamic system in vibration analysis. Due to the limits on computing resources, a submodel was utilized for MOR analysis. Within the three MOR techniques, Passive Reduced order Interconnect Macromodeling Algorithm (PRIMA) MOR technique performs better than the other techniques. Computational time ratio between reduced system iteration and the full system iteration is 1: 53.
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