Vertical Nanowire and Nanosheet FETs: Device Features, Novel Schemes for Improved Process Control and Enhanced Mobility, Potential for Faster & More Energy Efficient Circuits

2019 IEEE International Electron Devices Meeting (IEDM)(2019)

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摘要
We report on p and n-type vertical gate-all-around (GAA) nanowire (NW) and nanosheet (NS) FETs which offer attractive opportunities for ultra-scaled circuits. An in-depth evaluation is presented on the impact of doping and key device dimensions to improve the performance, variability, noise and reliability behavior for junctionless (JL) vs. inversion-mode (IM) vertical FETs built with an RMG scheme. The latter enables a novel concept to introduce stress in VFETs for enhanced mobility with up to a19% higher I ON predicted. SiGe/Si pillars and self-aligned spacers offer a solution to gate vertical (mis)alignment towards the S/D. As MRAM selector, VNS FETs can allow substantial area reduction (64% for 2VNS per cell; 3nm node design rules) vs. finFET based cells, with smaller read/write energy consumption and latency times.
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关键词
reliability behavior,junctionless vs. inversion-mode vertical FETs,RMG scheme,enhanced mobility,gate verticalalignment,VNS FETs,vertical nanowire,nanosheet FETs,device features,improved process control,faster & more energy efficient circuits,attractive opportunities,ultra-scaled circuits,in-depth evaluation,doping device dimensions,key device dimensions,size 3.0 nm
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