Vacuum-Assisted Selective Adhesive Imprinting For Heterogeneous System Integration Of Moems Devices Automated Assembly Of Miniaturized Pm Sensor

In this paper we propose the selective adhesive bonding technique using contact imprinting from thin adhesive layers spin-coated on the sacrificial polyethylene foils. The imprinting is assisted with vacuum release of the polymer foil to reduce the pull-off adhesive force and prevent sticking, posing less constraints on the required lifting force. We apply this method in assembly of a highly integrated optical particle counter confronted with several strict assembly requirements, such as selective bonding with small feature size (<200 mu m), minimal adhesive thicknesses (<15 mu m), precise out-of plane tolerances, low adhesive squeeze-out and hermetically sealed packaging. A successful selective adhesive bonding with ratio of vacuum tool area to adhesive contact area of 1:20 was demonstrated.