Gaas Schottky Components For 300 Ghz Communication Systems Using A Resonator Impedance Matching Approach

2019 44TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES (IRMMW-THZ)(2019)

引用 3|浏览49
暂无评分
摘要
A interconnection method has been developed to integrate GaAs Schottky diode components with hollow metal waveguides. Instead of using wired or probe impedance matching, an integrated resonator matching circuit has been adopted and a co-design method of active components with waveguide cavity filters developed. The approach transfers most of the matching circuitry from the lossy microstrip to low loss waveguide cavities. It minimises the footprint of the transition and improves the efficiency of the interconnection. This paper reviews the design and test of several building block components for a 300 GHz communications system. A 290-310 GHz single sideband mixer incorporates an integrated waveguide filter to achieve the required image rejection and impedance matching. A 135-150 GHz frequency tripler shows good impedance matching performance with an additional built-in filtering function.
更多
查看译文
关键词
built-in filtering function,frequency tripler,image rejection,integrated waveguide filter,single sideband mixer,low loss waveguide cavities,matching circuitry,waveguide cavity filters,active components,codesign method,integrated resonator matching circuit,probe impedance matching,hollow metal waveguides,interconnection method,resonator impedance matching approach,communication systems,Schottky components,frequency 300.0 GHz,frequency 290.0 GHz to 310.0 GHz,frequency 135.0 GHz to 150.0 GHz,GaAs
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要