Dynamic Thermal Management Of Silicon Interconnect Fabric Using Flash Cooling

Silicon interconnect fabric (Si-IF) is a promising packaging technology for system scaling. The direct attachment of heterogeneous dies on the Si-IF with compact die placement provides various improvements in electrical system performance. However, the high density of active silicon area leads to intense heat fluxes, and the resulting temperature distribution can cause significant performance degradation and system reliability issues. In this work, an efficient and dynamic cooling architecture is demonstrated for cooling of the Si-IF using thermally conductive terminal blocks that also deliver current. Flash cooling has been adopted, which is a new dynamic, high-heat flux cooling technique to mitigate temperature spikes due to episodic heat pulses in electronic components. A dynamically controlled flow loop for flash cooling is reported that is designed to be flexible and robust at various conditions to quantify and benchmark flash cooling. Results for a single terminal block bonded to a silicon die are presented for a single flash cooling pulse and a constant heat load condition with repeated flash cooling cycles.