HR3AM: A Heat Resilient Design for RRAM-based Neuromorphic Computing

2019 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)(2019)

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摘要
RRAM based accelerators have been widely adopted in many neuromorphic designs. However, RRAM cells are sensitive to temperature, which changes RRAM’s conductance. Such heat-induced interference can significantly decrease the computational accuracy because values are functions of RRAM conductance. In this paper, we propose HR 3 AM, a heat resilience design, which improves accuracy and optimizes the thermal distribution of RRAM based neural network accelerators. HR 3 AM consists of two key mechanisms: bitwidth downgrading and tile pairing. Bitwidth downgrading re-represents weights by shifting the conductance to improve the network inference accuracy. Tile pairing matches hot crossbar units with pre-defined idle units to mitigate high-temperature issues. We evaluated HR 3 AM on four real world neural network models. Results show that HR 3 AM improves classification accuracy by up to 41.8% compared with current state-of-the-art designs. For thermal optimization, HR 3 AM effectively decreases the maximum temperature by 6.2K and average temperature by 6K.
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关键词
hot crossbar units,real world neural network models,bitwidth downgrading,HR3AM,thermal optimization,high-temperature issues,pre-defined idle units,network inference accuracy,tile pairing,RRAM based neural network accelerators,heat resilience design,RRAM conductance,heat-induced interference,RRAM cells,neuromorphic designs,RRAM-based neuromorphic computing,heat resilient design
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