Large-area, kirigami topology structure-induced highly stretchable and flexible interconnects: Directly printing preparation and mechanic mechanism

Integrating the topology design and printing method offers a promising methodology to realize large stretchability for interconnects. Herein, eco-friendly and water-based Ag nanowires (NWs) inks were formulated and used for screen-printing highly stretchable and flexible interconnects on a large area (more than 335 mm × 175 mm). The stretchability of the interconnects was realized by introducing kirigami topology structures. The topology designed models were established to simulate the influence of kirigami patterns on wire compliance and to estimate the maximum stretchability via finite element analysis (FEA). The mechanic mechanism results demonstrate that an increase of the wave numbers results in larger stretchability, and the rectangular type of wave shows better stretchability than the zigzag and sine structures. Comparatively, the electrical and mechanical properties of the interconnects were measured and analyzed, and the experimental results were consistent with FEA. The electric conductivity of the interconnects is stable at ∼10,427 S cm −1 even after 1000 cycles of 15.83 mm radius bending, 280% stretching and 200% twisting-stretching deformation, demonstrating outstanding mechanical reliability of the interconnects. The topology designed interconnects have been applied in stretchable flexible light-emitting diode, indicating their broad application prospects in next-generation stretchable electronics.