Fabrication Of Double-Sided Fpc By Hydrolyzing-Doping-Plating Additive Process

A one-step fully additive chemical process to fabricate double-sided flexible printed circuit (FPC) is reported, the process includes the drilling of through-holes, hydrolysis of PI surface, adsorption of catalyst and selective copper deposition by electroless plating. The process mentioned in this paper requires simple operating procedure and mild reacting condition. The conductive copper patterns show a resistivity of 1.95 mu Omega . cm, and a high adhesion of 5B. Surface roughening can increase the mechanical anchor between deposited copper and PI, guaranteeing the good adhesion of copper patterns with high thickness about 12 mu m. With faster manufacture, less pollution, lower cost and double-sided patterns accessible, this process shows high development potential and a good application prospect in FPC fabrication. (C) 2018 The Electrochemical Society.