Parasitic Resistance Modeling And Optimization For 10nm-Node Finfet

2018 18TH INTERNATIONAL WORKSHOP ON JUNCTION TECHNOLOGY (IWJT)(2018)

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摘要
A TCAD-based study on the parasitic resistance (R-parasitics) of 10nm FinFET is perfolined. A total parasitic resistance of 1490 Omega/Fin is extracted using calibrated physical models, and the components of the R-parasitics are evaluated. It is observed that by introducing wraparound contact and highly doped source/drain, contact resistance (R-contact) of lOnm FinFET is well minimized and current crowding in the fin is suppressed. It is also found that the resistance of the lightly doped spacer region (R-spacer) constitutes more than 50% of total R-parasitics and can be optimized by introducing highly doped segments. With the optimized doping profile in the spacer, drain current (I-D) and intrinsic gain (A(V)) can be improved by 11% and 16%, respectively. In the case for 7nm-node FinFET, it was concluded that further R-contact reduction is also needed to optimize its perfounance.
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关键词
total parasitic resistance,calibrated physical models,wraparound contact,contact resistance,lightly doped spacer region,highly doped segments,optimized doping profile,FinFET,TCAD-based study,current crowding,intrinsic gain,size 10.0 nm,size 7 nm
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