Investigation on Steady-State and Transient Boundary Condition Scenarios for Optimizing the Creation of Multiport Surrogate Thermal Models

IEEE Transactions on Components, Packaging and Manufacturing Technology(2018)

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摘要
Board-level simulation has to consider, at the earliest stage of the conception, the impact of the vicinity of numerous high- and medium-powered devices. In 1996, the European consortium DELPHI defined the concept of a surrogate, or compact thermal model (CTM), to minimize the computation times from days to minutes. A DELPHI-style CTM resumes an electronic component as a simple cuboid form and a n...
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关键词
Numerical models,Computational modeling,Electronic packaging thermal management,Heat transfer,Steady-state,Boundary conditions,Heating systems
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