Development of an ultra-high density Power Chip on Bus (PCoB) module

A traditional power module uses metal clad ceramic (e.g. DBC or DBA) bonded to a baseplate that creates a highly thermally resistive path, and wire bond interconnect that introduces substantial inductance and limits thermal management to single-sided cooling. This paper introduces a Power Chip on Bus (PCoB) power module approach that reduces parasitic inductance through an integrated power interconnect structure. The PCoB maximizes thermal performance by direct attaching power chips to the busbar, integrating the heatsink and busbar as one, and uses a dielectric fluid, such as air, for electrical isolation. This new power module topology features all planar interconnects and double-sided air cooling. Performance evaluations are carried out through comprehensive electrical and multi-physics simulation and thermal testing for a 1200V, 100A rated single-switch PCoB design. Fabrication and assembly processes are included. For the developed double-sided air-cooled module, 0.5 degrees C/w thermal resistance and 8nH power loop parasitic inductance are achieved.