A 10Gb/s Si-photonic transceiver with 150μW 120μs-lock-time digitally supervised analog microring wavelength stabilization for 1Tb/s/mm2 Die-to-Die Optical Networks.

ISSCC(2018)

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摘要
Silicon photonics has allowed cost reduction and performance improvement for optical interconnects for the past few years, and short-reach wavelength-division-multiplexed (WDM) links have recently emerged thanks to the introduction of microring modulators and filters [1-5]. Nevertheless, the promise of optical networks-on-chip foreseen in [1] has to face the integration challenges of scalable low-footprint elementary drivers and robust operation under heavy thermal stress due to self-heating of the cores with varying loads. This work presents a 3D-stacked CMOS-on-Si-photonic transceiver chip, which includes base building-blocks targeting die-to-die WDM optical communication for multicore processors: 10Gbps 2.5V pp OOK modulator driver, associated receiver, and digitally-supervised analog wavelength stabilization using microring heaters and remapping for 0-to-90°C operating range, for a total footprint of 0.01mm 2 per microring.
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关键词
wavelength-division-multiplexed links,optical interconnects,performance improvement,cost reduction,silicon photonics,die-to-die optical networks,analog microring wavelength stabilization,microring heaters,digitally-supervised analog wavelength stabilization,OOK modulator driver,WDM optical communication,base building-blocks,CMOS-on-Si-photonic transceiver chip,heavy thermal stress,robust operation,low-footprint elementary drivers,networks-on-chip,microring modulators,power 150.0 muW,voltage 2.5 V,temperature 0 degC to 90 degC,time 120 mus,bit rate 10 Gbit/s,Si
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