Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology
Electronic Components and Technology Conference(2017)
摘要
Electromagnetic (EM) and circuit modeling are the prevailing practices for the anticipation and extraction of data transfer performances of 3D interconnects in a system-in-package (SiP). In comparison, this paper proposes a more abstract and cost-efficient evaluation method and an enhancement method thereof from the perspective of network information theory and communication channel modeling. Firstly, as the basis of the modeling, effects of non-idealities along data path and interferences are investigated by EM and circuit modeling and simulations, adopting typical 3D data links and their neighboring data lines as examples. Then, a channel model covering the data link of interest, based on network information theory, is established to anticipate its bit error rate (BER) as a key performance index up to a bit rate of 10Gbps, which is demonstrated to be intuitive and time-efficient. Eventually, a performance enhancement measure is proposed utilizing channel coding. The effectiveness and overhead of 2 codes with error correction capabilities are evaluated against un-coded scenario, realizing an BER enhancement from 10exp(-1) to 10exp(-5). In comparison, most conventional measures are more physical ones like shielding and complex error-proof transceivers configurations, which are often prohibitive in SiP scenario due to cost or overhead reasons. Thus, the method proposed may not only be a cost-efficient supplement to existing design methodologies but as more intuitive and insightful one on a higher level of design.
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关键词
3D SiP,channel modeling,network information theory,communication coding,high-speed data transmission
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