Thermal analysis of wafer-level LED packages with multichips

Jaewan Choi,Jeungmo Kang,Jaewook Kim,Duhyun Kim,Geunho Kim,Yongseon Song,Yuho Won,Jeongsoo Lee

PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)（2007）

引用 0|浏览2

暂无评分

摘要

Thermal analysis of wafer-level packaged LEDs with red, green and blue multi-chips are investigated. With Si-MEMS technology, wafer-level packaged LEDs are useful for the high power applications such as back light unit (BLU) and general solid state lighting due to the compactness and integrated fabrication process. In this paper, thermal characteristics of wafer-level packaged white LEDs with multi-chips are investigated using both serial and matrix measurement methods.

查看译文

关键词

light-emitting diode (LED),wafer-level package,thermal characteristics,matrix measurement

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要